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Thin Film Passive Integrated Components Vs LTCC Components
        Submitted by Digitivity on January 7, 2009 7:06 AM

The days are not far away when we will actually see a series of “card-type” mobile phones being flaunted by the users. It will be a revolutionary paradigm shift in wireless communication era.

This utter shrinkage and slimming of mobile phones would not have been a possibility without the advent of ultra-improved thin film passive integrated components.

These thin film passive integrated components are surely a path breaking improvement in the field of wireless communication. They have already started being used as the most prominent substitute of LTCC(low-temperature co-fired ceramics) components.

Clearly, the bigger size of contemporary communication devices can be attributed to these not-so-efficient LTCC components. They are set to be gobbled up by the slim thin film passive integrated components. There are various reasons why the thin film components have become an essential thing for future wireless technology-

Extremely Reduced Wiring Distance : Any primary thin film passive integrated component can have a wiring distance of 20μm/20μm. However, it is expected to reduce even more as the technology improves. Moreover, even today, the distance can be reduced drastically using micro-wiring technology. Using such technology can bring the distance as low as 2μm.

Dense Stacking : The reduced wiring distance speaks a lot why the stacking of thin film components are much easier these days. When we compare, such components are 0.1mm thinner or more. Clearly, the use of ceramic substrate can make it more thinner resulting in more dense stacking.

No Property Deterioration : A device meant for 1GHz or more resists the reduction in its size and thickness. If the thinning of its dielectric layer is tried, the process results into a recognizable damage to the device. Higher insertion loss is one of the foremost complications. Such is not the case if a thin film component is used.

Decreasing Demand Of LTCC Components : The manufacturers of mobile devices are not ready to accept LTCC components as such components tend to prove an obstacle in producing thin and slim devices.

The increased obsession with much efficient and thinner devices has led to the increase in demand of thin film passive integrated components. Such components are not thicker than 0.9-1.0mm. Further, they sufficiently support thinning of dielectric layers and cut down the wiring distance.

Sufficient Q values : Most of the wireless communication devices need passive components which have proper and sufficient Q value. Thus a thin film integrated passive component becomes a viable option such purpose. Definitely, a component which has a Q value of up to 45 can be most suitable for a device of 3-4 GHz.

Suitable For Complex Designs : As far as simple communication designs are concerned, both the thin film components and the LTCC components work with equal ease and efficiency. But when it comes to use passive integrated components in complex communication designs, there is nothing which can beat the efficiency of thin film components. That is why, the size reduction of complex designs and a desired improvement in their performance is possible.

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